SMD stencil finish
Extend stencil life and improve printing results.
Due to the high packing density of electronic components on a printed circuit board, different paste volumes are often required. You need the right tool for the production of such assemblies: the stencil in step design. BECstep: fast, efficient, perfect for your assembly.
Precision from the very start: avoid costly rework! We produce customised stepped stencils tailored to your assembly requirements. The corresponding squeegee blade in step design is also available for all printer brands.
Our manufacturing techniques are etching and milling. We choose the ideal manufacturing process for the stencil layout. For example, steps of ≥ 80 μm are produced by milling with a gently rising or sloping chamfer. Consecutive steps and depressions can be realised on the topside and underside of stencils. Stepped stencils are available either for tensioning systems or in fixed frames.
Subscribe now to the Becktronic newsletter for the latest industry information, news from our company, and tips and trends concerning laser-cut SMD stencils and high-precision stencils for LTCC, wafer and special applications!