Stepped stencils 
BECstep

Stepped stencils
BECstep

Partially varying material thicknesses combined into a single stencil

Precise assembly with the BECKTRONIC secret weapon

Due to the high packing density of electronic components on a printed circuit board, different paste volumes are often required. You need the right tool for the production of such assemblies: the stencil in step design. BECstep: fast, efficient, perfect for your assembly.

Precision from the very start: avoid costly rework! We produce customised stepped stencils tailored to your assembly requirements. The corresponding squeegee blade in step design is also available for all printer brands.

Manufacturing process
Our manufacturing techniques are etching and milling. We choose the ideal manufacturing process for the stencil layout. For example, steps of ≥ 80 μm are produced by milling with a gently rising or sloping chamfer. Consecutive steps and depressions can be realised on the topside and underside of stencils. Stepped stencils are available either for tensioning systems or in fixed frames.

 
 
 

BECstep offers electronics production
key advantages:

  • Reduction of rework
  • No need to dispense additional solder paste for power components
  • Co-planarity problems can be compensated for
  • By assembling THT components at the same Wave soldering is not necessary
  • Suitable for special applications
 

Still have questions?

Contact person

Contact BECKTRONIC Jan-Michael Kipping
phone handset

+49 2743 9204 - 17

Monday through Friday, 8 - 17 hrs

 

Contact form

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